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5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature

5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature

5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature
  • 5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature
  • 5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature

5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature

Product Details:
Place of Origin: CHINA
Brand Name: HUITIAN
Certification: RoHS
Model Number: 5274
Detail Information
Place of Origin:
CHINA
Brand Name:
HUITIAN
Certification:
RoHS
Model Number:
5274
Physical Form:
Paste
Color Part A:
Blue
Color Part B:
White
Density PartA:
3.2 G/cm³
Density PartB:
3.2 G/cm³
Viscosity Part A:
250 MPa·s
Viscosity Part B:
250 MPa·s
Mixing Ratio:
1:1
Opearting Time @25 °C:
1h
Curing Time @25℃:
8h
Curing Time @120℃:
20mins
Curing Hardness (Shore 00):
50
Volume Resistivity:
1.0*10^12 Ω∙cm
Dielectric Strength:
6 KV/mm
Thermal Conductivity:
4.0 W/(m•K)
High Light:
High Temperature Gel Gap Filler , Huitian Thermal Gel Gap Filler , 5274 Thermal Gel Gap Filler
Trading Information
Minimum Order Quantity:
200 kg
Price:
Negotiation
Packaging Details:
400ml/cartridge; 25kg/barrel; 298kg/drum
Delivery Time:
5-8 days
Payment Terms:
L/C, T/T
Supply Ability:
2000T/Month
Product Description
 

5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature

 

Product Description

  • Silicone thermal conductive composite
  • Blue/white gel
  • 1:1 mixture of two components

 

 

Product Features:

  • Thermal conductivity: 4.0 W/m∙K
  • Excellent workability
  • Curing at room temperature or accelerated curing at high temperature
  • Low static/transient stress on substrates
  • High reliability under various conditions

 

 

Technical Parameters

Standards Items Unit Values
Visual Appearance (A/B) -
Blue/white
ASTM D792 Density (A/B) g/ml
3.2/3.2
/ Mix ratio - 1 :1 (W/W)
ASTM D2196 Viscosity Pa·s
250 ±100
ASTM D5470 Thermal conductivity W/(m·K)
4.0
ASTM D5470
 Thermal Impedance ℃·cm2 /W 0.43
ASTM D257 Volume resistivity

 

Ω·cm

 1.0×1012
ASTM D149 Dielectric strength KV/m 15
UL94 Flame rating - V-0
∕ Operating temperature ℃ -40-200
∕ Operating time @ 25℃ min ＞60
/

Cure time @ 25℃

 h 8
∕ Cure time@120℃ min 20

 

Main Applications:

  • Heat dissipation of lithium battery packs in new energy vehicles
  • Heat dissipation of battery packs in energy storage power stations
  • Automotive electronic equipment
  • Large storage devices
  • Communication equipment

 

Packing:

400ml/cartridge; 25kg/barrel; 298kg/drum

 

Storage:

Store at 8-25°C in a cool and dry place.

Shelf life is 6 months.

 
 
5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature 0

Tags:

High Temperature Gel Gap Filler,

Huitian Thermal Gel Gap Filler,

5274 Thermal Gel Gap Filler

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No. 251, Wenji Road, Songjiang District, Shanghai China E-mail: zhangsong@huitian.net.cn Tel: 15821230089 Tel: 15821230089
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