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9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
  • 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
  • 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
  • 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

Product Details:
Place of Origin: CHINA
Brand Name: HUITIAN
Certification: RoHS
Model Number: 9504
Detail Information
Place of Origin:
CHINA
Brand Name:
HUITIAN
Certification:
RoHS
Model Number:
9504
Physical Form:
Paste
Color:
Pink
Density:
3.2 G/cm³
Extrusion flow Rate:
20 G/min
Volume Resistivity:
1.0*10^13 Ω∙cm
Dielectric Strength:
8.0 KV/mm
Thermal Conductivity:
4 W/(m•K)
High Light:
No Residual Stress Type Thermal Gel , After Sizing Type Thermal Gel , Protecting Electronics Type Thermal Gel
Trading Information
Minimum Order Quantity:
200 kg
Price:
Negotiation
Packaging Details:
30cc/tube; 300cc/cartridge
Delivery Time:
5-8 days
Payment Terms:
L/C, T/T
Supply Ability:
2000T/Month
Product Description
 

9504 One-Component Pre-Curing Type Thermal Gel, which has no residual stress after sizing, effectively protects precision electronic components from damage

 

 

Product Description

 

  • Pink paste gel
  • One-part pre-curing type
  • Silicone thermal conductivity complex

 

 

Product Features:

 

  • High thermal conductivity 4W/m∙K
  • Very small BLT and very low thermal resistance
  • Soft adhesion and self-adhesive properties after dispensing
  • Excellent chemical and mechanical stability
  • No residual stress after sizing, effectively protects precision electronic components from damage

 

Technical Parameters

Reference standard Item Unit Value
GB/T 13354 Density g/cm3 3.2
-- Extrusion rate
(30ccEFD@90psi)
 g/min 30
ISO22007 Thermal conductivity W/ m·K 4.0
GB/T2408 Flame retardant / V0
GB/T2408 Volume resistivity Ω·cm ≥1.0×1013
ASTM D149 Dielectric strength Kv/mm 8.0
ASTM D5470 Minimum thickness mm 0.1

 

Main Applications:

  • Bare die chip low-stress mounting
  • Heat dissipation field of 5G communication boards
  • Automotive electronic equipment
  • Smart phone modules and consumer-electronics
  • Other high-value boards need to be reworked

 

Packing:

30cc/tube; 300cc/tube

 

Storage:

Store below 35°C in a cool and dry place.

Shelf life is 6 months.

 
 
9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics 0

Tags:

No Residual Stress Type Thermal Gel,

After Sizing Type Thermal Gel,

Protecting Electronics Type Thermal Gel

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No. 251, Wenji Road, Songjiang District, Shanghai China E-mail: zhangsong@huitian.net.cn Tel: 15821230089 Tel: 15821230089
The Largest R&D and Production Adhesive Supplier in China
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